Press Releases

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  Thermally Conductive Adhesive: 3M 8904 Twice the Thermal Conductivity at Half the Price

  3m releases new thermally conductive adhesive attachment tape in several thicknesses that offers incomparable performance at half the cost vs. the existing industry standard. Features Include: Good Thermal Conductivity (less than 1.5W/m K), Excellent Dielectric Performance, Low Thermal Impedance, Good Adhesion Performance Vibration Damping details>>
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  Microchip Releases Integrated Fan Speed Sensor That Predicts and Detects Fan Failure

  The TC670 is an integrated fan speed sensor that predicts and detects fan failure, preventing thermal damage to systems with cooling fans. When the fan speed falls below a user specified level, the TC670 asserts an ALERT signal. With this design, a critical minimum fan speed is determined by the user. The fan alert level is then set with a resistor divider on the THRESHOLD pin of the TC670. When... details>>
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  Avnet and CTS Announce the Release of a Comprehensive Thermal Solutions Guide for Xilinx All Programmable

  CTS Electronic Components, Inc., and Avnet Electronics Marketing, announce the release of a comprehensive thermal solutions guide for Xilinx All Programmablle FPGAs, 3D ICs and SoCs. The guide is a tool that enables thermal design experts to quickly identify heat sink solutions for their Xilinx All Programmable design. details>>
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  AMEC Thermasol - Micro Porous Ceramic Heat Sink Range

  AMEC Thermasol introduces a range of Micro Porous Ceramic Heat Sinks (MPCHS). Due to the open irregular structure of the Micro Porous Ceramic the heat sinks provide a 30% greater surface area to contact with the air compared to metal. Due to this structure the heat sinks have excellent heat dissipation and heat convection properties. Low profiles from 2mm, pricing comparable to copper and... details>>
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  Fuji-Poly Releases High Thermal Conductivity Film

  Fujipoly's new Sarcon 30-YR-a Thin Film is a high performance thermal interface solution. At 0.3mm thick this material exhibits a thermal conductivity of 2.2 W/m degree K with a thermal resistance of .28 degree Cin2/W. details>>
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  MC-21 Shipping Tonnage Quantities of Al-SiC Sheet and Al-SiC Ingot

  MC-21, Inc. (Metallic Composites for the 21st Century) recently announced that it is producing tonnage quantities of hot-rolled Al-SiC sheet and Al-SiC ingot containing up to 45 vol. % SiC. The Al-SiC sheet is being hot-rolled down to thicknesses of 0.5mm and even thinner in some formulations. details>>
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  IP68 Splash Proof Fans with Industry Leading Air Flow and Lifespan

  SANYO DENKI CO., LTD. has developed and introduced three models of splash proof fan. These cooling fans deliver IP68 rated water and dust resistance, and the longest lifespan and highest air flow in the industry. PWM control function is included. These fans are a perfect cooling solution for PV inverters, quick chargers for electric vehicles and LED panels. details>>
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  CTS Electronics Releases Fansinks for High Temperature Applications

  CTS Electronic Components announces the addition of fansinks for high temperature applications to its Electronic Components Solutions product portfolio, which already includes an extensive line of heat sinks and thermal management solutions. These new fansinks can maintain superior thermal dissipation for devices that emit high amount of heat. CTS' fansinks are available in a wide range of... details>>
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  Laird Technologies Features 67 Different Thermoelectric Assemblies For Thermal Management Applications

  Laird Technologies is an industry leader in high-performance, high-quality and highly-efficient thermoelectric assemblies (TEAs), Laird Technologies designs and manufacturers 67 different thermoelectric assemblies including: PowerCool Series Air-to-Air Thermoelectric Assembly, PowerCool Series Direct-to-Air Thermoelectric Assembly, Cascade Series Thermoelectric Assemblies, Tunnel Series... details>>
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  Thermacore Highlight on Heat Pipe Assemblies

  Heat pipe assemblies from Thermacore mean that thermal engineers can count on innovative, best-in-class thermal management solutions that offer industry-leading thermal performance, help control energy costs and maximize system life and reliability even under harsh conditions. Efficient, cost-effective cooling from compact-size thermal solutions - even where space is limited - can be realized... details>>