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Archived Magazines » July 2005

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Avoiding Galvanic Corrosion

Avoiding Galvanic Corrosion When selecting components for your cooling loop, you must consider their material compatibility as well as their individual performance. This article explains how to avoid galvanic corrosion in your cooling circuit by careful selection of components. details>>
 

New Liquid-to-Liquid System Offers Precise Temperature Control

New Liquid-to-Liquid System Offers Precise Temperature Control Lytron's new LCS20 liquid-to-liquid cooling system delivers precisely temperature controlled (±0.5°) liquid to process equipment and removes up to 20kW of waste heat. The system transfers ...... details>>
 

A SHORT COURSE AT THE SUMMIT 2005: DESIGN OF LIQUID COOLING SYSTEMS

A SHORT COURSE AT THE SUMMIT 2005: DESIGN OF LIQUID COOLING SYSTEMS This short course presents a birds-eye view of liquid cooling technology. While liquid cooling is not at all new, most civilian electronics cooling applications have been air cooled for the last couple of decades. details>>
 

Application Showcases Downstream Thermal Implications of Component Placement

Application Showcases Downstream Thermal Implications of Component Placement A recent printed circuit board (PCB) design application demonstrates how heat-dissipating components can preheat the air passing over downstream components, causing thermal problems that would otherwise not exist. Although some rules of thumb can be ....... details>>
 

Q&A on Mikros NCP

Q&A on Mikros NCP We have been shipping our cold plate in sample quantities for a few months now and are encouraged by the response we have received from those who have evaluated the NCP. In one case, a client has succeeded in dissipating 1900 Watts/cm2 with our standard 10 mm x 20 mm cold plate. details>>
 

Moving to Liquid Cooling: Common Sense Design Considerations

Moving to Liquid Cooling: Common Sense Design Considerations A FREE workshop offered by Lytron at CoolingZone's Business & Technology Summit in August 2005 details>>
 

Exhibitors at Summit 2005

Exhibitors at Summit 2005 In addition to a series of comprehensive lectures by industry experts and short presentations by CoolingZone suppliers, the exhibition area will be open during the summit so that you can interact with solution providers in a relaxed atmosphere details>>
 

Register by July 15, save $300

Register by July 15, save $300 Less than a week is left to take advantage of the saving of $300 for attending CoolingZone's Business & Technology Summit. details>>
 

Innovative Research Offers FREE Workshop at the Summit 2005

Innovative Research Offers FREE Workshop at the Summit 2005 Innovative Research will present Macroflow, an easy-to-use and computationally eficient software based on the Flow Network Modeling (FNM) approach for rapid system-level thermal design. details>>
 

High Heat Flux Removal by Microjet Impingement

High Heat Flux Removal by Microjet Impingement With a novel microfabrication approach, arrays of microjets with jet diameters of the order of hundreds of microns are shown to provide the very high heat transfer coefficients needed to remove heat fluxes in the range of 1kW/sq. cm. details>>
 

Everything You Know is Wrong -- Part 50

Everything You Know is Wrong -- Part 50 Sometimes you can't escape the sun, even in the shade. details>>
 

Low-cost, hi-powered CFD software liberates PCB designers

Low-cost, hi-powered CFD software liberates PCB designers CoolitPCB delivers power and affordability to board designers details>>
 

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