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Archived Magazines » December 2005

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Liquid Cooling: The Other Half of the Problem

Liquid Cooling: The Other Half of the Problem Liquid cooling is now recognized to be the only solution for removal of high heat fluxes. Devices that can remove heat fluxes in excess of 1kW/cm2 are technologically challenging, but a few are currently available. The other half of the problem in liquid cooling is cooling the coolant. In this article, we report on ultra-compact micro-channel heat exchangers developed at International Mezzo... details>>
 

Chip Level Dynamics, Part 2

Chip Level Dynamics, Part 2 Detailed chip level thermal design has been practised for many years. Typical applications are circuits with a few but powerful heat sources. For logical components it has so far been sufficient to look at clusters of sources rather than individual ones. The time when this approach needs to be refined is however fast approaching.rn details>>
 

Controller Automates Wind Tunnel Testing

Controller Automates Wind Tunnel Testing details>>
 

Dual-Sensor Board Measures Temperature and Air Flow Velocity

Dual-Sensor Board Measures Temperature and Air Flow Velocity details>>
 

Calgreg and Coolit Build Customer Loyalty

Calgreg and Coolit Build Customer Loyalty Aided by Coolit, Calgreg is saving its customers money and building the kind of customer relations that result in repeat business from satisfied buyers. The heat sink manufacturer, who services a spectrum of industries, creates custom designs that are frequently better than what the customer asks for. details>>
 

Advanced Thermal Solutions Receives ISO 9001:2000 Certification

Advanced Thermal Solutions Receives ISO 9001:2000 Certification details>>
 

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