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Press Releases

  • Glacier Computer Announces Another New Rugged Industrial Tablet

    Glacier Computer, a leading provider of rugged industrial computing solutions, announces the addition of the T710 to an already powerful line up of rugged tablet options. The T710 combines enhanced rugged specs, configurability and better value into one, very dependable package. Backed by Glacier�s, �Don�t Ask, Don�t Tell� warranty coverage, the T710 is the perfect data collection tool for any... details>>
  • Thermaltake NiC Series CPU Coolers Introduced

    Thermaltake, an industry leader in computer chassis, thermal solutions, and power supply units announces the most innovative product, NiC Series CPU Coolers. Incorporating the latest proprietary technology, Thermaltake introduces to the world the all new NiC series (consisting of the F3, F4, C4, and C5), inspired from its name "non-interference cooler", fully compatible with RAM of all... details>>
  • Smart Heat Sinks Feature Hybrid Cold Plate Heat Exchancher for Enhanced Cooling

    Smart HeatSinks offers the patented pumpless liquid cooling (PLC) system for cooling high heat flux electronic components and large power systems. This break-through technology makes it easier, simpler and affordable in liquid cooling using a hybrid cold plate heat exchancher details>>
  • Indium Corporation Features Metal Thermal Interface Materials at Semi-Therm

    Indium Corporation will feature metal thermal interface materials (TIMs) at Semiconductor Thermal Management and Measurement Symposium (Semi-Therm), on March 17-21 in San Jose, CA. Indium Corporation provides a wide selection of metal-based TIMs for reflow or compression. details>>
  • F-Chart Software Features their EES General Equation Solving Software

    F-Chart's software is a general equation-solving program that can numerically solve thousands of coupled non-linear algebraic and differential equations. A major feature of EES is the high accuracy thermodynamic and transport property database that is provided and used for equation solving. details>>
  • Jaro Thermal "Skive" Cooler Combines Copper Skived Heat Sink with Fan for Small Form Factors

    Jaro Thermal engineering team has developed a skived copper heat sink that is paired with leading edge 50x50x13 fan. The combination is ideal for Network interface cards, video graphic cards, PCI express & IC spot cooling: customizable fin thickness & pitch details>>
  • New Advanced Modine Cooling System Improves Fuel Economy for Transit Buses

    Modine Manufacturing Company, a world leader in thermal innovation, supplies its Advanced Cooling System technology to help over one hundred transit agencies in the United States and Canada save taxpayer dollars by reducing parasitic engine loss, which saves fuel and lowers greenhouse gas (GHG) emissions. The system also offers a significant reduction in maintenance costs, increased service life... details>>
  • Anasys Instruments Introduces AFM+ to Measure Spatially Resolved (sub-micron) Thermal Analysis

    The new AFM+� instrument is based on technology introduced in the late 90's by a major thermal analysis instrument manufacturer, but with substantial improvements. Resolution is better by more than an order of magnitude, the instrument has the ability to measure dynamic mechanical in addition to thermomechanical properties, and is much easier to use. details>>
  • Cirrascale's Vertical Cooling Technology Removes Hot-Cold Aisle Problem

    Cirrascale's Vertical Cooling Technology Removes Hot-Cold Aisle Problem. The high performance and cloud computing specialist's patented Vertical Cooling Technology allows 2x the rack compute density over standard rack cooling approaches. details>>
  • Nuventix Launches New LED Light 60% lighter and 33% smaller than its passive cooling equivalents.

    Nuventix's has released the SynJet R150-170, the smallest, lightest LED thermal solution for high bay fixtures available!. To answer the increase in cooling needs in the LED industry, the new LED Light can cool up to 20,000 lumens in a design that is 60% lighter and 33% smaller than its passive cooling equivalents. details>>
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