Press Releases

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  STULZ CyberCon Offers Precision Environmental Control for Containerized Computer Rooms

  The STULZ CyberCon modular cooling solution is ideal for rapid deployment of PODs and delivers energy-efficient precision cooling performance. details>>
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  CD-adapco announces the release of STAR-CCM+ v8.02

  Today, CD-adapco announced the release of STAR-CCM+ v8.02, a major new version of its integrated solution for multidisciplinary engineering problems. details>>
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  TDK-Lambda Release Compact Convection-Cooled High-Efficiency 300W AC-DC Power Supply

  TDK-Lambda has release a compact convection-cooled high-efficiency open frame type AC-DC power supply "ZWS300BAF" with 300W maximum rating. details>>
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  JMC Counter-Rotating Fan Technology Ideal for High Density, Small Form Factor, Applications

  JMC Counter-Rotating Fan Technology is idea for high density, small form factor, applications such as 1U servers, power supplies, dense computing. Counter-rotating technology creates extremely powerful and concentrated airflow while maintaining high efficiency and an outstanding performance (PQ) curve. details>>
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  Pentair Features an Extended Air Conditioner Product Line

  Pentair Equipment Protection is featuring an extension to their air conditioner line wit the McLean SPECTRACOOL Compact Air Conditioners. These air conditioners include standard, narrow and compact models. Designed to efficiently deliver vital cooling to sensitive electronics within enclosures, SPECTRACOOL compact air conditioners provide 1,000 and 2,000 BTUs/Hr. (293-585 Watts) of cooling in a... details>>
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  Applied Nanotech Features CarbAL a Passive Thermal Management Material

  APPLIED Nanotech is featuring CarbAL, a passive thermal management material called CarbAl, for use in hot-running electronics. CarbAl is lighter than aluminium (1.75 g/cm3 compared to 2.7 g/cm3), less expensive than copper, and is approximately three times better at diffusing heat. details>>
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  Arctic Silver features its Ceramique 2 Tri-Linear Ceramic Thermal Compound.

  Arctic Silver features its Ceramique� 2 Tri-Linear Ceramic Thermal Compound. The high-density, ceramic-based thermal compound is specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions. details>>
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  Henkel Releases New Thermal Paste with Enhanced Thermal Conductivity That Can Reduce Contact Resistance 20 Percent

  The new thermal material was developed by Henkel Electronic Materials, to meet the stringent requirements of Infineon Technologies AG. This thermal paste is now available from Henkel. The development of the new heat conducting material focused on ease of processing in the form of honeycombs stencil-printed on modules. This prevents air from becoming trapped in the link to the heat sink. Also,... details>>
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  Emerson Network Power Expands Offering of AutoDesk Models with Addition of Liebert DS Precision Cooling System

  Emerson Network Power, a global leader in maximizing availability, capacity and efficiency of critical infrastructure, today expanded its AutoDesk building information modeling (BIM) software offering with the release of BIM-enabled Revit models of standard Liebert� DS precision cooling systems. BIM-enabled Revit models of standard Liebert DS precision cooling systems are available globally. details>>
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  PCAnalyze by K and K Asociates is an engineering application used to mathematically model and predict PCB thermal behavior

  K and K associates highlights their PCAnalyze Application. PCAnalyzie is an engineering application used to mathematically model and predict the thermal behavior of printed circuit assembly (PCA) designs. Component placement, cooling strategies, or "worst case" conditions can be quickly evaluated using this software. details>>