Press Releases

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  Mentor Graphics Launches New T3Ster DynTIM Tester to Deliver Unrivaled Thermal Interface Material

  Mentor Graphics Corporation announced the new T3Ster� DynTIM� tester, the industry's cutting-edge method of measuring thermal characteristics of thermal interface materials (TIM). details>>
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  Dc-dc step-down regulator with integrated heat sink delivers up to 100A

  LINEAR TECHNOLOGY LTM4620 dual 13A per output or single 26A output dc-dc micromodule step-down regulator delivers up to 100A when four devices are current shared. Device is a complete dc-dc regulator system in a 15mm x 15mm x 4.41mm LGA package, including inductors, power stages and all control circuits. For optimum heat dissipation, a patented top side heat sink removes heat quickly and evenly. details>>
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  New Electronically Commutated ECOFIT� Backward Curved Impellers Now Available for Uninterruptible Power Supply, Variable Frequency Drive, and Inverter Applications

  Reliable air movement is a necessity for specialized equipment such as uninterruptible power supplies (UPS), variable frequency drives (VFD), rectifiers or inverters. New ECOFIT� electronically commutated backward curved impellers provide cooling airflow more quietly, efficiently and dependably. details>>
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  Ohmite manufacturing announces cp4 series cold plate four-pass heatsink

  The CP4 Series of heatsinks provide maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor devices for variable speed drives, power supplies, robotics, and motor controls applications. The RoHS compliant CP4 Series also offers design flexibility, with customizable options to fit multiple applications. In addition to its pre-drilled hole patterns for... details>>
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  LORD Corporation Develops New Flame-Retardant Urethane Encapsulant

  LORD Corporation has announced the availability of a new flame retardant urethane encapsulant for the electronic materials industry. details>>
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  Laird Technologies Releases New eTEG Series Thin Film Thermoelectric Module Product Line

  Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new eTEG Series Thin Film Energy Harvesting product line. details>>
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  Advanced Power Electronics Releases New Regulator for Low Power Low Cost Power Designs

  Advanced Power Electronics Corp. (USA), a leading manufacturer of MOS power semiconductors for DC-DC power conversion applications, today announced the APU3037-3 controller IC designed to be a low cost synchronous buck regulator for on-board dc to dc converter applications. details>>
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  Investor Group Purchases Plansee Thermal Management Solutions

  San Diego-based Plansee Thermal Management Solutions has recently been acquired by a private investor group led by The Courtney Group of Newport Beach and Pegasus Capital Group of Santa Monica. The value of the transaction was not disclosed. details>>
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  Advanced Thermal Solutions' Surface Thermography Liquid Crystals Reveal Hot Spots in Electronic Devices

  The TLC-100 Kit from Advanced Thermal Solutions features spray-on thermochromic liquid crystals which change color at different temperatures to reveal heat issues on chips and other electronic components. By applying these liquid crystals, engineers can visually find hotspots and temperature fields. details>>
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  Fujipoly Releases their Zebra 2004 Elastomeric Connector for tight contact spacing

  Fujipoly's Zebra� 2004 Elastomeric Connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronic device such as an LCD display. This unique construction makes the connector ideal for devices with contact spacing as low as .020" (.50mm). details>>