Archived Magazines » October 2005

Back to Archive

Chip Level Dynamics

Chip Level Dynamics About temperature variations on the nano scale level. It has always been an issue for power components. Today, when the heat density for various logical circuits approaches 100 W/cm2, it is fast becoming a problem that not can be overlooked. The purpose is to provide an overview, not to present accurate calculations methods. details>>

Performance of Mikros NCP for different Fluids

Performance of Mikros NCP for different Fluids Although water provides the best thermal performance in a liquid cooling system, there are applications where other considerations, such as extended temperature range or dielectric properties, require the use of a different fluid. Other thermal management fluids commonly used include water-glycol mixtures, Dynalene, and PAO. details>>

Dow Corning Attendance at Semi-Therm

Dow Corning Attendance at Semi-Therm Dow Corning recently hosted a booth and workshop at Semi-Therm, where we introduced Dow Corning® TC-5022, a new thermally ...... details>>

Controllable Wind Tunnel Allows Thermal and Airflow Testing on Multiple PCBs

Controllable Wind Tunnel Allows Thermal and Airflow Testing on Multiple PCBs Norwood, MA, October 2005 – Advanced Thermal Solutions, Inc. (ATS) has introduced the CWT-PCB™ controlled wind tunnel for laboratory testing of heat and air flow on multiple PCBs.... details>>

Flomerics Incorporates Thermal Models of Sunon Fans on SmartParts3D Website

Flomerics Incorporates Thermal Models of Sunon Fans on SmartParts3D Website Flomerics has incorporated thermal models of Sunon fans into its SmartParts3D website. This means engineers using or considering Sunon fans can streamline ......... details>>

Dow Corning's Newest Conductive Grease Qualified for use in AMD Microprocessor Packages

Dow Corning's Newest Conductive Grease Qualified for use in AMD Microprocessor Packages Midland, Mich. – Dow Corning Corporation today announced that its new thermally conductive grease, DOW CORNING® TC-5022, has been approved by AMD for use on its AMD64 processors ..... details>>

COOLIT ELIMINATES COSTLY REDESIGNS

COOLIT ELIMINATES COSTLY REDESIGNS With the help of Coolit, ADVA AG Optical Networking is detecting potential thermal problems early in the development phase while engineers are still able to change cabinet and board designs. As a result .... details>>

JEDEC 51 Testing Assures Consistent Thermal Evaluation Data

JEDEC 51 Testing Assures Consistent Thermal Evaluation Data Norwood, MA, October 2005 – Advanced Thermal Solutions (ATS) is now providing JEDEC 51 testing services, which offer component, board .... details>>