Press Releases

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  Ohmite Releases HVC Series of High Voltage Chip Resistors

  Ohmite Manufacturing has released the HVC Series of precision high-value, high-voltage wraparound chip resistors, available in 0805, 1206, and 2512 package sizes. The Ohmite HVC Series has a 100 ppm standard TCR and tolerances as tight as 0.50 percent. details>>
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  COOLTRON Releases New Sourcing Tool For Fans and Blowers

  COOLTRON, a manufacturer of fans, blowers and other technology used in cooling, have released a new cross-reference for their fans and blowers, making it easier for engineers to second source important cooling components. details>>
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  High Conductivity Aluminum Plates with Embedded Heat Pipes is the Featured Product at Advanced Cooling Technologies

  Advanced Cooling Technologies has announced their featured product this month: High Conductivity Aluminum Plates. The plates are 6061 aluminum with embedded heat pipes to increase thermal conductivity. The heat pipe layout can be customized to cool multiple power components allowing for higher input power for your system. details>>
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  Two Part Epoxy System with Outstanding Thermal Conductivity Released by Master Bond

  Master Bond Polymer Adhesive EP21AOLV-1 is a two component, thermally conductive, electrically isolating epoxy adhesive, sealant and coating. This versatile system will adhere to a wide variety of substrates including metals, glass, ceramics and many plastics. While its primary use is for potting and encapsulating, it is also an excellent adhesive that forms high strength bonds. details>>
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  CTS Electronic Components announces a full line of heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance.

  CTS Electronic Components, Incorporated (NYSE: CTS) announces a full line of forged and extruded heat sink products that are convenient and easy to use, while maintaining an exceptional thermal performance. These heat sinks are applicable for BGA, PGA, PLCC, QFP and other IC packages. details>>
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  Arctic Silver Corporation Releases ArcticClean: Industry First Workable Thermal Material Remover & Surface Purifier

  Arctic Silver Corporation, the company that was created from the merger of Arctic Silver and Nanotherm technology have released ArctiClean. ArctiClean is a two-step cleaning process that removes existing thermal grease or pads and prepares the thermal surface for a fresh application of thermal interface material. details>>
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  OCZ Technology Adds New 750W and 850W Power Supply Models to Its PC Power & Cooling Silencer Mk III Portfolio

  OCZ Technology Group, Inc. a leading provider of high-performance solid-state drives (SSDs) and power management solutions for computing devices and systems, announced that it has added 750W and 850W power supply unit (PSU) models to the award-winning Silencer Mk III Power Supply Series from PC Power & Cooling. With these new high-wattage options, the Silencer Mk III provides a... details>>
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  AOS releases MICRO-FAZE, a revolutionary thermal interface film formulated with non-silicone thermal grease

  MICRO-FAZE is a new, revolutionary thermal interface film formulated with non-silicone thermal grease. It was developed by AOS to offer the lowest thermal resistance in a thermal interface without the mess of grease. MICRO-FAZE does not require burn-in to form into place. details>>
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  Future Facilities Announces the Release of 6SigmaDC 7.1

  New improvements incorporated into 6SigmaDC Release 7.1 enable users to build powerful CFD models more confidently and quickly than ever before details>>
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  Stockwell Elastomerics now provides 10 and 20 durometer Shore A Liquid Silicone Rubber (LSR) molded gaskets, sheets and custom components.

  Low Durometer (Very Soft) Molded Liquid Silicone Rubber Gaskets now available from Stockwell Elastomerics, Inc. These low durometer compounds provide designers the option of using a soft solid rubber gasket when foam or sponge gaskets are unable to prevent water ingress. details>>