Press Releases

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  Emerson Network Power Receives Patent for Innovative High Density Data Center Cooling Technology

  Emerson Network Power, a business of Emerson (NYSE:EMR) and a global leader in maximizing availability, capacity and efficiency of critical infrastructure, announced today that it has received a U.S. patent for its flexible, energy-saving Liebert� XD cooling technology for high heat density data center applications. details>>
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  Arekma's new foam core pipes bring improvemens to flexibility, thermal conductivity, acoustic insulation

  A foam core structure that encapsulates a highly foamed center layer with solid interior and exterior layers is the key to achieving 50% lightweighting in a polyvinylidene difluoride (PVDF) pipe developed by Arkema Inc. (King of Prussia, PA). The technology is based on patent-pending foam concentrate technology known as Kynar Flex 2620 FC masterbatch resin. details>>
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  New Rosenberg USA Web Site Makes Finding The Right OEM Fans and Blowers Faster

  Rosenberg USA, Inc. has launched a new website which provides multiple search options for OEM fan and blower specifiers including parametric search, search by fan type, by product line and by industry application. Results can be sorted by fan size, CFM, voltage or fan type. Product data sheets are available for most items within the search results. details>>
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  Silicon Labs To Collaborate In Development Of EEMBC Ultra-Low Power Microcontroller Benchmark

  The Embedded Microprocessor Benchmark Consortium (EEMBC) today announced that Silicon Laboratories Inc. (NASDAQ:SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, has joined the consortium�s working group developing a benchmark for ultra-low power microcontrollers (MCUs). details>>
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  Incubation Integration Through Temperature@lert's 4-20mA and 0-2VDC Smart Sensor Adapter Boards

  Temperature@lert has released 4-20mA and 0-2VDC smart sensor adapter boards that integrate with Astec Heracell incubators for carbon dioxide and oxygen monitoring. details>>
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  DAAT Introduces CoolitDC CFD software designed to analyzes an entire facility, individual racks, and servers, or zeroes-in on the smallest board or component.

  Designed to predict and optimize the thermal performance of data centers, CoolitDC analyzes an entire facility, individual racks, and servers, or zeroes-in on the smallest board or component. It is the analytical tool data center managers depend on for informed decision-making. details>>
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  Intermark Announces Thermal Interface Material: Thermal Tape Qoolite� Thin

  Intermark's newest Thermal Interface Material (TIM) Tape, is excellent for applications that have limited space. This product provides excellent adhesive properties and heat resistance between heat sinks and any heat source including ICs, chips, and CPUs. details>>
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  More Fans Use Less Energy In New Rittal Cooling System

  The latest versions of Rittal�s Liquid Cooling Package (LCP) units have added fans to move air more efficiently and with less effort. And, using six fans has proven to consume less energy than the traditional use of three or four. More fans, each running at slower speeds, draw less energy while moving an equal or greater volume of cool air. details>>
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  Fujipoly Announces Availability of Sarcon 50GR-Ae Thermal Interface Material

  Fujipoly announces the availability of Sarcon� 50GR-Ae, an extremely soft .5mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material allow it to protect delicate board-level components as it fills unwanted air gaps and levels uneven surfaces. details>>
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  Aavid Thermalloy Releases New Line of DC Brushless Fans and Blowers

  Aavid Thermalloy is focusing on OEM, ODM and private label clients with custom design and manufacture DC brushless fans and blowers. The product line features Aavid's "FLB" bearing structure designed to increases the fan life efficiency by 30% compared to the sleeve bearing. details>>