Press Releases

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  Dow Premieres Next-Generation FLUIDFILETM Software Used To Help Choose Best Fluid for Liquid Cooling

  The Dow Chemical Company (Dow) will unveil a highly-anticipated update to its popular FLUIDFILETM software program during an educational presentation in booth 1433 at the 2013 AHR Expo, January 28-30 in Dallas, Texas. details>>
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  SinkPAD Unveils best Thermal Management Star PCBs for Philips Luxeon-T and Cree MK-R high power LEDs

  SinkPAD announces availability of SinkPAD Star PCB for the new Luxeon-T and the Cree MK-R LEDs at the Strategies in Light Show, Santa Clara Convention Center, CA, USA on February 12th-14th, 2013. details>>
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  Boulder Wind Power's modular full scale power converters set new precedent for high performance and low cost in wind power applications

  Boulder Wind Power (BWP) announced today that the latest test results incorporating its proprietary power converter technology at full scale demonstrated an unmatched level of power quality for wind power applications. BWP's converter design drastically reduces damaging voltage stresses while improving the quality of the voltage and current waveforms at competitive industry costs. This unmatched... details>>
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  ATS Heat Sinks Compatible with Sitara ARM Microprocessors

  Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments. ATS' patented maxiFLOW� heat sinks with superGRIP� clip attachment ensure maximum performance and long-term product reliability for the Sitara ARM Microprocessors, used in ARM9 and ARM Cortex-8 MPUs. details>>
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  Indium Corporation Features Thermal Management and Solder Materials, Compounds for LED Manufacturing at Strategies in Light

  Indium Corporation will feature thermal management and solder materials for LED manufacturing at Strategies in Light, February 12-14, 2013, in Santa Clara, California. details>>
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  Thermaltake announces Bigwater 760 Pro

  Thermaltake Liquid Cooling Systems Bigwater 760 Pro, the new Dual drive bay design from Thermaltake includes many new design features including an aluminum fan radiator that delivers better performance than the predecessors; controllable low noise and high performance 12CM blue LED fan (fan speed between 1600 to 2400 RPM) with a front control VR knob to adjust fan speed conveniently; ultra quiet... details>>
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  Emerson to apply Ovation technology at first U.S. commercial-scale solar power facility with fully integrated energy storage

  Ovation� platform's integrated control and diagnostics will deliver operations and maintenance efficiencies at the Crescent Dunes Solar Energy Plant details>>
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  Laird Technologies Staff Scientist, Dr. Jeff Hershberger, to present on: Efficient Thermoelectric Cooling of Concentrated Heat Loads

  Dr. Jeff Hershberger, Laird Technologies Staff Scientist and Technology Leader, will participate in a poster presentation session on Tuesday, February 5 from 6 p.m. to 8 p.m. Dr. Hershberger's paper, "Efficient Thermoelectric Cooling of Concentrated Heat Loads". His presentation is part of Laird's attending and presenting at SPIE Photonics West 2013. The event will be held at The... details>>
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  UMC Debuts Thick Plated Cu Process for Monolithic PMIC Use

  United Microelectronics Corporation (UMC), a leading global semiconductor foundry, today introduced a Thick Plated Copper (TPC) process for power management IC (PMIC) applications. details>>
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  Microsemi Expands Silicon Carbide (SiC) Power Module Product Family

  Microsemi, a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of a new generation of industrial temperature, silicon carbide (SiC) standard power modules. They are ideally suited for use in high power switch mode power supplies, motor drives, uninterruptible power supplies, solar inverters, oil exploration... details>>