11th International Business & Technology Summit

Thermal and Energy Management Technologies for the Next Decade - Challenges and Opportunities -Keynote, Day-1 .
by Suresh V. Garimella, Ph.D.

From health care to education to security, almost every aspect of life has benefited from the Silicon Revolution. Integrated circuits serve as the -brains- of nearly all engineered entities that require rapid acquisition, transfer, and interpretation of information. The continued evolution of electronics for the 21stCentury, however, requires a fundamental shift in perspective, coupled with major read more

The Future of Solid State Lighting Is Bright But - Why Is It Taking so Long? Keynote, Day-2 .
by Victor Zaderej, M.S.

We have all heard about the benefits of Solid State Lighting (SSL), a revolutionary source of light that will dramatically reduce energy requirements, allow us to shine light onto any surface from a - rainbow - of colors, and will virtually last our entire lives. Although all of these benefits are technically achievable today, we do not see them in our daily lives because either the products are not read more

An Overview of the Challenges In Thermal Testing .
by Robert J. Moffat, Ph.D.

Today\'s engineers require skilled knowledge to effectively plan and respond to the many challenges faced in the thermal testing of electronics. In this lecture, we will focus on temperature measurements in air-cooled systems (surface and coolant) in a reasonably well-equipped lab. We will discuss the application and error characteristics of thermocouples, RTDs, thermistors, IR cameras, and liquid read more

Challenges and Innovations in Avionics and Military Electronics Thermal Management .
by Jim Wilson, Ph.D.

Avionic and defense electronic systems are continuing to add functionality and features resulting in thermal design engineers being tasked to devise efficient thermal management approaches with minimum weight, volume, and cost. While adding the latest high performance devices often increases dissipated heat loads, the ambient environment is still at the mercy of nature. Difficulties in thermal read more

Challenges of Thermal Management and Design of Compact 3-D Microsystems. An Integrated System Level Approach. .
by Ihab Andre Ali, Ph.D.

The lecture provides an overview of thermal design performance limitations and thermal management techniques covering 3-D Microsystems. Thermal challenges are discussed including a key thermal design parameter concerning outer skin temperature limits based on natural convection and radiation with the ambient. The lecture covers an overview on internal IC\'s thermal performance enhancements utilizin read more

Thermal Design and Management of High Power LEDs .
by Norbert P. Engelberts,

Light emitting diodes (LED) used to have a strong presence in instrumentation and computer as visual indicator for signal integrity and device operations status. In these applications, LEDs were ideal since they are highly reliable, low power while requiring little to no maintenance. The latter features of LEDs piqued the market interest for their use not only as indicator but also as lighting dev read more

Design of Liquid Cooled Heat Sinks and Cold Plates: Some Fundamental Concepts for Transitioning from Air Cooled Solutions .
by Alfonso Ortega, Ph.D.

For decades electronics thermal management has relied primarily on air-cooled solutions, but indirect liquid cooling via cold plates and liquid cooled heat sinks has become a necessary part of the potential design space as the thermal margin for air cooling vanishes. Just as in the early days of air cooling, the design of liquid cooled heat sinks and cold plates has not always followed a rigorous read more

Thermal Design of Telecommunications Equipment: Challenges and Requirements .
by Majid Safavi,

Thermal design of telecommunications equipment poses challenges that are unique to the industry. In addition to common electronic thermal design considerations, telecommunications equipment has to be designed to specific and more stringent mechanical, thermal, fire, efficiency, reliability requirements which are defined by the service providers, standard bodies, and regulatory agencies such as FCC read more

THERMAL ENGINEERING CHALLENGES AT THE DEVICE AND MICROPROCESSOR LEVELS .
by Medhi Asheghi, Ph.D.

The power distribution non-uniformities across chips results in sharp temperature gradients and multiple temperature peaks across a microprocessor or chip, which can adversely impact reliability and performance. Therefore, microprocessor packaging and cooling solutions should not only consider the worst case senario but must also take into account the imapct and ramifiactions of the non-uniformi read more

Short Course: Thermal Management of Electronics -Calculations, Measurements, Simulation, Review and Selection of Cooling Options. .
by Kaveh Azar, Ph.D.

Design engineers are dealing with more heat problems than ever before and the task of mitigating those thermal issues within cost and time constraints have never been more challenging. Please join Dr. Kaveh Azar, a global electronics cooling expert and the President and CEO of Advanced Thermal Solutions, Inc. in a full day thermal management presentation that will provide an introduction to electronics thermal management for current and next-generation electronics. read more