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Library
coolingZONE Library – where engineers and researchers go to see the latest and archived developments in thermal management.
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Test methods for characterizing the thermal transmission properties of phase-change thermal interface materials
- bob rauch, power devices, inc. explores the methods for testing the thermal transmission properties of phase-change materials. Read more »Thermal testing and control by means of built-in temperature sensors
- v. szekely, technical university of budapest, explains a new method for measuring the thermal properties of a pcb that uses the ic chips to acquire and measure temperature data. Read more »Temperature measurement using optical fibers
- chuck schietinger, luxtron corp., explains how fiber optic technology can be used in temperature measurement studies. Read more »Notes on using thermocouples
- dr. robert j. moffat, stanford university, describes how thermocouples are made and how they are used to produce accurate temperature measurements. Read more »Microthermal imaging in the infrared
- john mcdonald, latigo optics and grant albright edo/barnes engineering division, explains the fundamentals of infrared physics and their application in measuring micro-circuit temperatures. Read more »Measuring fluid velocity in electronic enclosures
- k. azar, lucent technologies, explains how to measure fluid velocity with sensors in electronic enclosures. Read more »Measuring chip temperatures with thermochromic liquid crystals
- dr. kaveh azar, lucent technologies - bell laboratories, and dino j. farina, image therm engineering, inc., describe liquid crystal thermography and its application in temperature mapping studies. Read more »Making surface temperature measurements using liquid crystal thermography
- dino j. farino, image therm engineering, inc., explains the techniques behind surface temperature measurements using liquid crystal thermography. Read more »The increasing importance of thermal test dies
- marta rencz, ph.d., micred ltd., explains why thermal test dies have become increasingly important in measuring the heat transfer properties of electronics packages. Read more »Heat transfer measurements in electronics cooling applications
- ned r. keltner, ktech corporation, explores the challenges in heat transfer measurements in electronics cooling applications. Read more »Experimental evaluation of the local convective heat transfer from configurations of wall-mounted cubes in a channel flow
- e. r. meinders and k. hanjalic, delft university of technology, evaluate experimental methods for calculating the distributions of local heat transfer coefficient. Read more »Environmental stress testing - a product improvement method
- harry i. saraidaridis, at&t bell laboratories, describes the environmental stress method and its implementation in development and manufacturing processes. Read more »Electrical temperature measurement using semiconductors
- dr. john w sofia, analysis tech, explains the electrical method of junction temperature measurement. Read more »Topics and Articles in Electronics Cooling
- Data Center
- State of the Art in Data Center Thermal Management
- State of The Art In Data Center Thermal Management – 2013
- State of The Art In Data Center Thermal Management– 2011-2012
- State of The Art In Data Center Thermal Management– 2010-2011
- State of The Art In Data Center Thermal Management– 2009-2010
- State of The Art In Data Center Thermal Management– 2008-2009
- State of The Art In Data Center Thermal Management– 2007-2008
- State of The Art In Data Center Thermal Management– 2006-2007
- State of The Art In Data Center Thermal Management– 2005-2006
- State of The Art In Data Center Thermal Management– 2004-2005
- State of The Art In Data Center Thermal Management– 2003-2004
- State of The Art In Data Center Thermal Management– 2002-2003
- Air Flow Simulation In Data Centers
- Air Flow Simulation In Data Center– 2013
- Air Flow Simulation In Data Center– – 2011-2012
- Air Flow Simulation In Data Center– 2010-2011
- Air Flow Simulation In Data Center– 2009-2010
- Air Flow Simulation In Data Center– 2008-2009
- Air Flow Simulation In Data Center– 2007-2008
- Air Flow Simulation In Data Center– 2006-2007
- Air Flow Simulation In Data Center– 2005-2006
- Air Flow Simulation In Data Center– 2004-2005
- Air Flow Simulation In Data Center– 2003-2004
- Air Flow Simulation In Data Center– 2002-2003
- Air Flow Measurement in Data Centers
- Air Flow Measurement in Data Centers– 2013
- Air Flow Measurement in Data Centers– 2011-2012
- Air Flow Measurement in Data Centers – 2010-2011
- Air Flow Measurement in Data Centers – 2008-2009
- Air Flow Measurement in Data Centers– 2007-2008
- Air Flow Measurement in Data Centers– 2006-2007
- Air Flow Measurement in Data Centers– 2005-2006
- Air Flow Measurement in Data Centers– 2004-2005
- Liquid Cooling For Data Center Thermal Management
- Use of Liquid Cooling for Data Center Thermal Management– 2013
- Use of Liquid Cooling for Data Center Thermal Management– 2011-2012
- Use of Liquid Cooling for Data Center Thermal Management– 2010-2011
- Use of Liquid Cooling for Data Center Thermal Management– 2009-2010
- Use of Liquid Cooling for Data Center Thermal Management– 2008-2009
- Use of Liquid Cooling for Data Center Thermal Management– 2007-2008
- Use of Liquid Cooling for Data Center Thermal Management– 2006-2007
- Use of Liquid Cooling for Data Center Thermal Management– 2005-2006
- Use of Liquid Cooling for Data Center Thermal Management– 2004-2005
- Use of Liquid Cooling for Data Center Thermal Management– 2003-2004
- Use of Liquid Cooling for Data Center Thermal Management– 2002-2003
- State of the Art in Data Center Thermal Management
- Fan - Air Mover
- Role of Fans in Electronics Cooling
- use of fans in electronics cooling– 2013
- use of fans in electronics cooling– 2011-2012
- use of fans in electronics cooling– 2010-2011
- use of fans in electronics cooling– 2008-2009
- use of fans in electronics cooling– 2007-2008
- use of fans in electronics cooling– 2006-2007
- use of fans in electronics cooling– 2005-2006
- use of fans in electronics cooling– 2004-2005
- use of fans in electronics cooling– 2003-2004
- Fan Characterization
- Fan Reliability
- Fan Selection
- Role of Fans in Electronics Cooling
- Graphene
- Heat Sink
- Heat Sink Design
- "heat sink design"– 2013
- "heat sink design"– 2011-2012
- "heat sink design"– 2010-2011
- "heat sink design"– 2009-2010
- "heat sink design"– 2008-2009
- "heat sink design"– 2007-2008
- "heat sink design"– 2006-2007
- "heat sink design"– 2005-2006
- "heat sink design"– 2004-2005
- "heat sink design"– 2003-2004
- "heat sink design"– 2002-2003
- Heat Sink Optimization
- "Heat Sink Optimization"– 2013
- "Heat Sink Optimization"– 2011-2012
- "Heat Sink Optimization"– 2010-2011
- "Heat Sink Optimization"– 2009-2010
- "Heat Sink Optimization"– 2008-2009
- "Heat Sink Optimization"– 2007-2008
- "Heat Sink Optimization"– 2006-2007
- "Heat Sink Optimization"– 2005-2006
- "Heat Sink Optimization"– 2004-2005
- "Heat Sink Optimization"– 2003-2004
- "Heat Sink Optimization"– 2002-2003
- Role of Heat Sink Material In Its Thermal Performance
- "Heat Sink Material"– 2013
- "Heat Sink Material"– 2011-2012
- "Heat Sink Material"– 2010-2011
- "Heat Sink Material"– 2009-2010
- "Heat Sink Material"– 2008-2009
- "Heat Sink Material"– 2007-2008
- "Heat Sink Material"– 2006-2007
- "Heat Sink Material"– 2005-2006
- "Heat Sink Material"– 2004-2005
- "Heat Sink Material"– 2003-2004
- "Heat Sink Material"– 2002-2003
- Heat Sink Design
- Jet Impingement
- Single Jet
- Array of Jets
- Single Jet
- Liquid Cooling
- Thermal Chracterization of Cold Plates
- Thermal Characterization of cold plates– 2013
- Thermal Characterization of cold plates– 2011-2012
- Thermal Characterization of cold plates– 2010-2011
- Thermal Characterization of cold plates– 2009-2010
- Thermal Characterization of cold plates– 2008-2009
- Thermal Characterization of cold plates– 2007-2008
- Thermal Characterization of cold plates– 2006-2007
- Thermal Characterization of cold plates– 2005-2006
- Thermal Characterization of cold plates– 2004-2005
- Thermal Characterization of cold plates– 2003-2004
- Thermal Characterization of cold plates– 2002-2003
- Thermal Design of Cold Plate
- Thermal Design of Cold Plate– 2013
- Thermal Design of Cold Plate– 2011-2012
- Thermal Design of Cold Plate– 2010-2011
- Thermal Design of Cold Plate– 2009-2010
- Thermal Design of Cold Plate– 2008-2009
- Thermal Design of Cold Plate– 2007-2008
- Thermal Design of Cold Plate– 2006-2007
- Thermal Design of Cold Plate– 2005-2006
- Thermal Design of Cold Plate– 2004-2005
- Thermal Design of Cold Plate– 2003-2004
- Thermal Design of Cold Plate– 2002-2003
- Role of Cold Plate Material In Its Thermal Performance
- Cold Plate Cooling
- Selection Of Coolant For Liquid Cooling
- selection of a coolant for liquid cooling with cold plate– 2013
- selection of a coolant for liquid cooling with cold plate– 2011-2012
- selection of a coolant for liquid cooling with cold plate– 2010-2011
- selection of a coolant for liquid cooling with cold plate– 2009-2010
- selection of a coolant for liquid cooling with cold plate– 2008-2009
- selection of a coolant for liquid cooling with cold plate– 2007-2008
- selection of a coolant for liquid cooling with cold plate– 2006-2007
- selection of a coolant for liquid cooling with cold plate– 2005-2006
- selection of a coolant for liquid cooling with cold plate– 2004-2005
- selection of a coolant for liquid cooling with cold plate– 2003-2004
- selection of a coolant for liquid cooling with cold plate– 2002-2003
- Thermal Chracterization of Cold Plates
- Microchannels - Their Role In Electronics Cooling
- Microchannels In Electronics Cooling
- microchannel in electronics cooling– 2013
- microchannel in electronics cooling– 2011-2012
- microchannel in electronics cooling– 2010-2011
- microchannel in electronics cooling– 2009-2010
- microchannel in electronics cooling– 2008-2009
- microchannel in electronics cooling– 2007-2008
- microchannel in electronics cooling– 2006-2007
- microchannel in electronics cooling– 2005-2006
- microchannel in electronics cooling– 2004-2005
- microchannel in electronics cooling– 2003-2004
- microchannel in electronics cooling– 2002-2003
- Manufacturing of Microchannel
- manufacturing of microchannel – 2013
- manufacturing of microchannel – 2011-2012
- manufacturing of microchannel – 2010-2011
- manufacturing of microchannel – 2009-2010
- manufacturing of microchannel – 2008-2009
- manufacturing of microchannel – 2007-2008
- manufacturing of microchannel – 2006-2007
- manufacturing of microchannel – 2005-2006
- manufacturing of microchannel – 2004-2005
- manufacturing of microchannel – 2003-2004
- manufacturing of microchannel – 2002-2003
- Heat Transfer Coefficient
- heat transfer coefficient for microchannel– 2013
- heat transfer coefficient for microchannel– 2011-2012
- heat transfer coefficient for microchannel– 2010-2011
- heat transfer coefficient for microchannel– 2009-2010
- heat transfer coefficient for microchannel– 2008-2009
- heat transfer coefficient for microchannel– 2007-2008
- heat transfer coefficient for microchannel– 2006-2007
- heat transfer coefficient for microchannel– 2005-2006
- heat transfer coefficient for microchannel– 2004-2005
- heat transfer coefficient for microchannel– 2003-2004
- heat transfer coefficient for microchannel– 2002-2003
- Pressure Drop Simulation and Estimation
- pressure drop in microchannel– 2013
- pressure drop in microchannel– 2011-2012
- pressure drop in microchannel– 2010-2011
- pressure drop in microchannel– 2009-2010
- pressure drop in microchannel– 2008-2009
- pressure drop in microchannel– 2007-2008
- pressure drop in microchannel– 2006-2007
- pressure drop in microchannel– 2005-2006
- pressure drop in microchannel– 2004-2005
- pressure drop in microchannel– 2003-2004
- pressure drop in microchannel– 2002-2003
- Design of Microchannels for Electronics Cooling
- designing microchannels for electronics cooling– 2013
- designing microchannels for electronics cooling– 2011-2012
- designing microchannels for electronics cooling– 2010-2011
- designing microchannels for electronics cooling– 2009-2010
- designing microchannels for electronics cooling– 2008-2009
- designing microchannels for electronics cooling– 2007-2008
- designing microchannels for electronics cooling– 2006-2007
- designing microchannels for electronics cooling– 2005-2006
- designing microchannels for electronics cooling– 2004-2005
- designing microchannels for electronics cooling– 2003-2004
- designing microchannels for electronics cooling– 2002-2003
- Microchannels In Electronics Cooling
- Refrigeration
- Use of Refrigeration In Electronics Cooling
- "refrigeration" and "electronics cooling"– 2013
- "refrigeration" and "electronics cooling"– 2011-2012
- "refrigeration" and "electronics cooling"– 2010-2011
- "refrigeration" and "electronics cooling"– 2009-2010
- "refrigeration" and "electronics cooling"– 2008-2009
- "refrigeration" and "electronics cooling"– 2007-2008
- "refrigeration" and "electronics cooling"– 2006-2007
- "refrigeration" and "electronics cooling"– 2005-2006
- "refrigeration" and "electronics cooling"– 2004-2005
- "refrigeration" and "electronics cooling"– 2003-2004
- "refrigeration" and "electronics cooling"– 2002-2003
- Use of Refrigeration In Electronics Cooling
- Thermal Interface Materials (TIM)
- TIM Thermal Characterization
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- Thermal characterization of interface materials– 2013
- Thermal characterization of interface materials– 2011-2012
- Thermal characterization of interface materials– 2010-2011
- Thermal characterization of interface materials– 2009-2010
- Thermal characterization of interface materials– 2008-2009
- Thermal characterization of interface materials– 2007-2008
- Thermal characterization of interface materials– 2006-2007
- Thermal characterization of interface materials– 2005-2006
- Thermal characterization of interface materials– 2004-2005
- Thermal characterization of interface materials– 2003-2004
- Thermal characterization of interface materials– 2002-2003
- TIM Reliability
- thermal interface material reliability– 2013
- thermal interface material reliability– 2011-2012
- thermal interface material reliability– 2010-2011
- thermal interface material reliability– 2009-2010
- thermal interface material reliability– 2008-2009
- thermal interface material reliability– 2007-2008
- thermal interface material reliability– 2006-2007
- thermal interface material reliability– 2005-2006
- thermal interface material reliability– 2004-2005
- thermal interface material reliability– 2003-2004
- thermal interface material reliability– 2002-2003
- TIM - Phase Change
- "phase change thermal interface material"– 2011-2012
- "phase change thermal interface material"– 2010-2011
- "phase change thermal interface material"– 2009-2010
- "phase change thermal interface material"– 2008-2009
- "phase change thermal interface material"– 2007-2008
- "phase change thermal interface material"– 2006-2007
- "phase change thermal interface material"– 2005-2006
- "phase change thermal interface material"– 2013
- TIM Thermal Characterization