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  • Swedish researchers demonstrate efficient solar energy storage in liquid

    Researchers at the Chalmers University of Technology in Gothenburg, Sweden have demonstrated an efficient method for storing solar energy in chemical liquid, which can be...
  • Researchers find way to outwit thermal noise in quantum communications

    Scientists at the University of Innsbruck and TU Wien (Vienna) in Austria developed a new quantum communication protocol intended to secure the transfer of information...
  • KAUST researchers create flexible thermoelectric generators

    A team of researchers at the King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia have created a new method for enhancing the power generation...
  • Fujitsu Labs exploring semiconductor packaging as thermal solution

    Fujitsu Labs has researched new devices, materials and packaging technologies for the Hyperconnected Cloud (HYCC).
  • UT-Dallas researchers find patriotic breakthrough for advanced electronics

    A team of researchers at that University of Texas at Dallas made an unexpected breakthrough in their study of materials that could be suitable for powering next-generation...
  • 3-D printed liquid battery could cool future computer chip stacks

    Researchers from IBM Zurich and ETH Zurich have 3-D printed a tiny redox flow battery, where an electrochemical reaction produces electricity from two liquid electrolytes...
  • FAU researchers create largest diamond foil in the world

    Researchers at the University of Erlangen-Nuremberg (FAU) in Germany have taken a step forward in the process of creating diamond foils for practical applications by creating...
  • Researchers add coating to silicon semiconductors to enhance conductivity

    A team of researchers from the Agency for Science, Technology and Research Institute of Materials Research and Engineering developed a monolayer coating using supercritical...
  • Researchers show bubble-recoil could cool microchips in space

    Scientists at the University of Illinois at Chicago, funded by NASA, have demonstrated how to utilize the minuscule force that is created by forming bubbles on a heated...

Microfabrica Presents New FINJET Thermal Management Design at SEMI-THERM 33

Microfabrica, the world leader in Advanced Additive Manufacturing, presented performance results from their novel FINJET thermal management device at the SEMI-THERM. details>>

ATS fanSINK with maxiGRIP adds air flow at the device level

ATS offers a large family of fanSINK products for applications where FPGA or ASICs in BGA packages are deployed. details>>

Elenion Technologies Demonstrates Silicon Photonic on-Board Optics

Elenion Technologies, an innovator in silicon photonic technologies, announced it will demonstrate Optical-Interconnect-Devices (OIDs) for direct-attach fiber-to-the-server and parallel multi-channel on-board modules for switches. details>>

Mentor Graphics Receives Harvey Rosten Award for Thermal Heatsink Optimization Methodology

Mentor Graphics Corporation announced that Dr. Robin Bornoff, Dr. John Parry and John Wilson, a team from Mentor Graphics Mechanical Analysis Division, received the Harvey Rosten Award for Excellence in thermal modeling and analysis of electronics. details>>

Bel Power Solutions Announces Next Generation Regulated Bus Converter

Bel Power Solutions, a Bel group company and premier global manufacturer of power management devices, announces the 0RQB-X0S10BG. details>>

Phononic Brings High-Performance Electronics Cooling to Asia Pacific

Phononic, the company revolutionizing cooling and heating with solid-state technology, announced it is has expanded its global footprint within the Asia Pacific region with the opening of a sales office in Taiwan. details>>

Fujipoly offering new form-in-place TIM to fill large gaps

Fujipoly SARCON SPG-30B is a highly conformable/thermally conductive, high viscosity type silicone compound. details>>

MAHLE moves into vehicle electronics with purchase of Nagares

MAHLE plans to take over Spanish electronics specialist Nagares SA. details>>

Ultra-Low Dropout 150mA Regulator from Diodes Inc. Supports Wide Input Voltage Range

Diodes Incorporated, a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic, analog and mixed-signal semiconductor markets, introduced the AP7380. details>>

PSMA Announces APEC 2017 Industry Session on 3D Power Packaging

The Power Sources Manufacturers Association (PSMA) Packaging Committee is sponsoring an Industry Session at APEC 2017 titled, "Component, Reliability and Manufacturing Innovations for 3D Power Packaging." details>>

Cool Technologies Granted New Patent for Radial Vent Cooling

On February 24, 2017, Cool Technologies, Inc., an innovator in mobile power generation, energy efficiency, and heat removal technologies received the US patent (9,543,809) for its radial vent heat pipe system. details>>

CeramTec acquires UK electro-ceramics business from Morgan Advanced Materials

CeramTec announced that it has agreed the acquisition of the U.K. electro-ceramics business, comprising two manufacturing sites at Ruabon and Southampton, from Morgan Advanced Materials. details>>

Global Electric Vehicle Battery Thermal Management System Market 2017-2021

The consumption of rechargeable batteries is growing globally, covering all major sectors, including consumer electronics, energy, automotive, and telecom. details>>

Delta Unveils Pioneering Agema Data Center and Carrier-Grade Deep Buffer White Box Switches

Delta announced the launch of two switches from its Agema product line for Open Networking Solutions at the OCP US Summit 2017. details>>

Corvus Energy announces availability of liquid-cooling for Orca ESS

Corvus Energy, the world?s leading manufacturer of lithium-ion based energy storage systems (ESS) for maritime industries, is pleased to announce the availability of Orca LQ. details>>

Egide completes the acquisition of Santier in the USA

Following its strategy to concentrate on high-potential markets, Egide, announces that is has acquired, as planned, the assets of TMS LLC (or Thermal Management Solutions, dba Santier), with the conditions laid down previously with them. details>>

MediaTek Announces CorePilot 4.0 Technology for Power Efficiency in Smartphones

MediaTek announced CorePilot 4.0, an advanced technology that intelligently manages smartphone tasks to deliver the perfect balance of processing power and battery life. details>>

Amerlux introduces DOSM LED downlight optically sealed module for exterior fixtures

Amerlux introduces the DOSM LED optically sealed module for exterior lighting fixtures that include a downlight component. details>>

Fujipoly offers reliable connection between PCB and LCD displays

The Zebra 1002 Carbon Connector from Fujipoly offers electronic device manufacturers an extremely affordable and reliable option for connecting printed circuit boards to a variety of LCD displays. details>>

Alphacool Presents the Eiswand Water Cooling Set for CPUs

Alphacool presents the Eiswand, "Ice Wall," a water cooling set for your CPU that can also be expanded on through its two quick-release connectors. details>>

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