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  • Nanostructure of silk fibers could lead to better understanding of heat transfer

    According to a report on the Purdue University website, researchers have discovered that the nanostructure of silkworm fibers causes Anderson localization of light, which...
    details>>
  • Researchers measure the temperature of 2-D materials at atomic level

    Researchers from the University of Illinois - Chicago (UIC) have developed a new technique for precisely measuring the temperature and behavior of novel 2-D materials that...
    details>>
  • Simulation methods to give scientists greater predictive power of material properties

    Scientists from IBM Research and the U.K. Science and Technology Facilities Council (STFC) Hartree Center have created new simulation techniques for predicting the properties...
    details>>
  • Flexible, water-repellent graphene circuits developed for washable electronics

    Scientists at Iowa State University (Ames, Iowa) used inkjet printing technology to build circuits on flexible materials using flakes of graphene that are then welded...
    details>>
  • New methods could make spintronic devices more applicable

    Researchers at the University of California - Riverside (UCR) have developed methods for detecting signals from spintronic components composed of low-cost metals and silicon,...
    details>>
  • Thermal infrared solution makes it possible for 360-degree view with single sensor

    A team of researchers at the VTT Technical Research Centre of Finland have created a new solution for thermal infrared applications that allows for the folding of a...
    details>>
  • Climate chamber allows for environmental testing in the lab

    The Fraunhofer Institute for Machine Tools and Forming Technology IWU has developed a new climate chamber that allows for the testing of machines in different environmental...
    details>>
  • Scientists create electron-hole liquid at room temperature

    Researchers at North Carolina State University (Raleigh, N.C.) have published a study that demonstrates the process for creating a liquid of electrons and electron holes at...
    details>>
  • Study shows fluid-like heat flow in solid semiconductor at nanoscale

    Thanks to thermal imaging techniques, researchers at Purdue University (West Lafayette, Ind.) are now using the same hydrodynamic transport model that is used in the study of...
    details>>

ATVS-NxT from ATS provides quick and precise air temp and velocity measurement

The ATVS-NxT hot wire anemometer from Advanced Thermal Solutions, Inc. (ATS) is a fully-portable scanner that provides rapid and highly precise temperature and air velocity measurements in electronic packages. details>>

Larson Electronics Releases 150-Watt High Bay Cold Forged LED Light

Larson Electronics, longtime leading supplier of commercial and industrial grade lighting solutions, has announced the release of a new 150-watt high bay LED light fixture. details>>

Asetek Receives Order from Fujitsu to Cool Fastest AI Supercomputer System in Japan

Asetek announced a new order from existing OEM partner Fujitsu for the National Institute of Advanced Industrial Science and Technology (AIST). details>>

Vertiv Completes Acquisition of Geist, Expands Global Rack PDU Portfolio

Vertiv, formerly Emerson Network Power, completed its purchase of Geist, a privately-owned manufacturer of rack power distribution units (PDUs) and associated data center power products. details>>

Rosenberg Introduces High-Efficiency Backward Curved Fans With w5.5 kW EC Motors

The new KH Series fans from Rosenberg include 450 mm, 500 mm, and 560 mm models. details>>

Renesas Electronics Unveils Fully Encapsulated Digital Power Modules

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced two new fully encapsulated digital DC/DC PMBus power modules that deliver the highest power density and efficiency in their class. details>>

Liquid Cold Plate Technology Delivers up to 3 times the performance

D6 Industries has introduced the HydroTrak liquid cold plates for high-performance cooling of power electronics. details>>

TE Connectivity enables future of 400GbE at DesignCon 2018

TE Connectivity (TE), a world leader in connectivity and sensors, announced the showcasing of OSFP and QSFP-DD connectivity products at DesignCon that will soon enable 400-Gigabit Ethernet in a range of data center devices. details>>

Unifrax Launches Next-Generation Insulfrax Ltx Products

Unifrax I LLC unveiled its next-generation Insulfrax LTX Products with enhanced physical properties to improve both thermal performance and product handling. details>>

Trane Introduces Agility, A New Solution for Existing Buildings

Trane, a leading global provider of indoor comfort systems and services and a brand of Ingersoll Rand, is now offering Agility, a new water-cooled centrifugal chiller product line. details>>

ATS using multiple seats of Future Facilities 6SigmaET software

Engineering simulation software leader Future Facilities and thermal industries innovation leader Advanced Thermal Solutions, Inc. (ATS) are pleased to announce that ATS has purchased multiple seats of 6SigmaET. details>>

ANSYS Announces Winners of 2018 Hall of Fame Competition

The winning entries of the annual ANSYS Hall of Fame competition highlight how engineers are solving complex challenges with ANSYS Pervasive Engineering Simulation solutions across various industries. details>>

Seek Thermal Showcases New Thermal Sensors for IoT at CES 2018

Seek Thermal, the company behind some of the most groundbreaking, low cost, and high-resolution thermal imaging products and core platforms, showcased its thermal imaging technology and demonstrate a concept designed specifically for IoT at CES 2018. details>>

Modine Displays Atherion D Cabinet HVAC Unit at AHR Expo 2018

Modine Manufacturing Company, a leader in technology in the HVAC industry, showcased the new Atherion D cabinet HVAC unit at booth No. 3152 at the 2018 AHR Expo, Jan. 22-24, in the North Hall of McCormick Place in Chicago. details>>

Bristol Compressors and DHX Electric Machines Develop Next Gen Compressor Motors

Bristol Compressors International, LLC and DHX Electric Machines, Inc. announced an exclusive global strategic partnership to develop Next Gen HVAC/R compressor technology leveraged by ultra-high torque density electric motors. details>>

Crystal Group partners with Intel, VMware, and DC Systems to Deliver Robust Compute Solution

Crystal Group Inc., a leading designer/manufacturer of rugged computer hardware, is joining forces with industry partners Intel, VMware, and DC Systems to help utilities monitor, manage, and modernize critical power infrastructures. details>>

Fujipoly Thin Film Delivers on Performance

This product is ideal for transferring performance-killing heat from high power semiconductors and board-level components to nearby cooling heatsinks. details>>

TAT Technologies Awarded 2-Year Agreement with Korean Air

TAT Technologies Ltd. announced that its subsidiary, Limco Airepair, Inc. has signed a two-year agreement with Korean Air to provide maintenance, repair and overhaul (MRO) for heat exchangers placed in Korean Air's aircrafts. details>>

Vertiv Expands Thermal Management Portfolio with Acquisition of Energy Labs

Vertiv, formerly Emerson Network Power, has acquired Energy Labs, a privately owned, U.S.-based manufacturer of custom air handling systems. details>>

Techsil Introduces New Medical Grade Potting Epoxy

Techsil adds epoxy-based adhesive Structalit 8801 to its portfolio of medical grade adhesives. details>>

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